Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
07/27/2004
|
Application #:
|
10042829
|
Filing Dt:
|
01/08/2002
|
Publication #:
|
|
Pub Dt:
|
07/10/2003
| | | | |
Inventors:
|
Chi Wah Cheng, Ping Chun Chong, Chi Fung Chan, Chin Pang Chan
|
Title:
|
APPARATUS AND METHOD OF PLACING SOLDER BALLS ONTO A SUBSTRATE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
4/F., WATSON CENTRE |
16 KUNG YIP ST. |
KWAI CHUNG, HONG KONG |
|
|
|
OSTROLENK, FABER, GERB ET AL. |
ROBERT C. FABER |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 1036-8403 |
|
|
Assignment:
2
|
|
|
|
CORRECTIVE TO CORRECT THE FOURTH ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL 012807 FRAME 0678. (ASSIGNMENT OF ASSIGNOR'S INTEREST)
|
|
|
|
|
|
4/F., WATSON CENTRE |
16 KUNG YIP ST. |
KWAI CHUNG, HONG KONG |
|
|
|
OSTROLENK, FABER, GERB & SOFFEN, LLP |
ROBERT C. FABER |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 10036-8403 |
|
|
Search Results as of:
09/22/2024 04:01 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|