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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/10/2004
Application #:
09760439
Filing Dt:
01/13/2001
Publication #:
Pub Dt:
07/18/2002
Inventors:
Ying-Chou Tsai, Jen-Yi Tsai
Title:
METHOD OF FABRICATING A FLIP-CHIP BALL-GRID-ARRAY PACKAGE WITHOUT CAUSING MOLD FLASH
Assignment: 1
Reel/Frame:
011463/0925Recorded: 01/13/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/11/2000
Exec Dt:
12/11/2000
Assignee:
NO. 123, SEC. 3, DA FONG ROAD TANTZU
TAICHUNG, TAIWAN R.O.C
Correspondent:
EDWARDS & ANGELL, DIKE ET AL.
PETER F. CORLESS
130 WATER STREET
BOSTON, MA 02109
Assignment: 2
Reel/Frame:
015886/0173Recorded: 10/15/2004Pages: 7
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
10/07/2004
Assignee:
625 N. FLAZLER DRIVE
SUITE 400
WEST PALM BEACH, FLORIDA 33401
Correspondent:
GARY M. KRASNA, P.A.
3010 N. MILITARY TRAIL
SUITE 210
BOCA RATON, FL 33431

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