Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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10154082
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Filing Dt:
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05/22/2002
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Inventors:
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Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Harold D Perry et al
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Title:
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METHOD AND APPARATUS FOR UNIFORM ELECTROPLATING OF THIN METAL SEEDED WAFERS USING MULTIPLE SEGMENTED VIRTUAL ANODE SOURCES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3970 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| BEYER WEAVER & THOMAS, LLP |
| BRIAN D. GRIEDEL |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3970 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| BEYER WEAVER & THOMAS, LLP |
| JEFFREY K. WEAVER |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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