Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10614671
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
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01/15/2004
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Inventor:
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Kye Chan Park
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 891-10, DAECHI-DONG, KANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-280 |
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| TIMOTHY J. KEEFER |
| SEYFARTH SHAW LLP |
| 55 E. MONROE |
| SUITE 4200 |
| CHICAGO, ILLINOIS 60603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1650 TYSON?S CORNER |
| SUITE 1580 |
| TYSON?S CORNER, VIRGINIA 22102 |
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| PAGE CONNAGHAN |
| 4101 LAKE BOONE TRAIL |
| SUITE 300 |
| RALEIGH, NC 27607 |
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