Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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09856491
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Filing Dt:
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06/19/2001
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Inventors:
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Toshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida et al
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Title:
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CMP ABRASIVE, LIQUID ADDITIVE FOR CMP ABRASIVE AND METHOD FOR POLISHING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHISHINJUKU 2-CHOME, |
| SHINJUKU-KU, TOKYO 163-0449,, JAPAN |
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| ARMSTRONG, WESTERMAN, HATTORI ET AL |
| STEPHEN G. ADRIAN |
| 1725 K STREET, N.W. |
| SUITE 1000 |
| WASHINGTON, D.C. 20006 |
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