Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/21/2004
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Application #:
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10421310
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Filing Dt:
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04/22/2003
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Inventor:
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Chia-Pin Chiu
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Title:
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SUBSTRATE-LESS MICROELECTRONIC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052-8119 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| PAUL A. MENDONSA |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 401 E. HWY. 59 & 175 |
| IDA GROVE, IOWA 51445 |
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| STURM & FIX LLP |
| MICHAEL O. STURM |
| 206 SIXTH AVE. |
| STE. 1213 |
| DES MOINES, IA 50309-4076 |
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