Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/09/2004
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Application #:
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10657230
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Filing Dt:
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09/09/2003
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Publication #:
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Pub Dt:
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05/13/2004
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Inventors:
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Shih-Chang Lee, Gwo-Liang Weng, Wei-Chang Tai, Cheng-Yin Lee
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Title:
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FLIP CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD RD. |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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BACON & THOMAS, PLLC |
EUGENE MAR |
625 SLATERS LANE FOURTH FLOOR |
ALEXANDRIA, VA 22314 |
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