Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10249572
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Filing Dt:
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04/21/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Inventors:
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Cheng-Chieh Yang, Wen-Long Chen, Yao-Huang Tsai, Chih-Liang Hu, Pan-Nan Chen
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Title:
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METAL BONDING METHOD FOR SEMICONDUCTOR CIRCUIT COMPONENTS EMPLOYING PRESCRIBED FEEDS OF METAL BALLS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 31, YONG HSIN LANE, YINGTAU ROAD, YINGGE TOWN |
TAIPEI HSIEN, TAIWAN |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7 FLOOR-1, NO. 100 |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI, TAIWAN 100 |
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