Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10341711
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Filing Dt:
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01/14/2003
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Publication #:
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Pub Dt:
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04/15/2004
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Inventors:
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Nai-Hao Kao, Yu-Po Wang, Wen-Jung Chiang
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Title:
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CAVITY-DOWN BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH HEAT SPREADER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD |
TANTZU, TAICHUNG, TAIWAN R.O.C. |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
P.O. BOX 9169 |
BOSTON, MASSACHUSETTS 02209 |
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