Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10758392
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Filing Dt:
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01/16/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Inventor:
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Norio Okada
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR IMPROVING ADHESIVITY OF COPPER METAL LAYER TO BARRIER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI |
| KANAGAWA, JAPAN 211-8668 |
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| YOUNG & THOMPSON |
| YOLANDA REYNOLDS |
| 745 SOUTH 23RD STREET |
| ARLINGTON, VA 22202 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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