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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/07/2004
Application #:
10267158
Filing Dt:
10/08/2002
Publication #:
Pub Dt:
04/08/2004
Inventors:
C. Key Chung, Kum Foo Leong, Sook Chien Chan
Title:
APPARATUS AND METHODS FOR INTERCONNECTING COMPONENTS TO VIA-IN-PAD INTERCONNECTS
Assignment: 1
Reel/Frame:
013376/0168Recorded: 10/08/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2002
Exec Dt:
10/05/2002
Exec Dt:
10/05/2002
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
SCHWABE WILLIAMSON & WYATT
PAUL J. FORDENBACHER
1211 SW 5TH AVENUE
SUITES 1600-1900
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
028362/0802Recorded: 06/12/2012Pages: 62
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/22/2011
Assignee:
8000 S. FEDERAL WAY
BOISE, IDAHO 83707
Correspondent:
SCHWABE WILLIAMSON & WYATT
PACWEST CENTER, SUITE 1900
1211 SW FIFTH AVENUE
PORTLAND, OR 97204

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