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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/04/2005
Application #:
10269910
Filing Dt:
10/11/2002
Publication #:
Pub Dt:
05/01/2003
Inventor:
Jen-Kuang Fang
Title:
FLIP CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
013640/0363Recorded: 01/07/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/25/2002
Assignee:
NO.26, CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOSHIUNG, KAOSHIUNG TAIWAN, CHINA
Correspondent:
LADAS & PARRY
WILLIAM R. EVANS
26 WEST 61ST STREET
NEW YORK, NY 10023

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