Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/04/2005
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Application #:
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10269910
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Filing Dt:
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10/11/2002
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Publication #:
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Pub Dt:
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05/01/2003
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Inventor:
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Jen-Kuang Fang
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Title:
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FLIP CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.26, CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOSHIUNG, KAOSHIUNG TAIWAN, CHINA |
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LADAS & PARRY |
WILLIAM R. EVANS |
26 WEST 61ST STREET |
NEW YORK, NY 10023 |
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