Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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10329810
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Filing Dt:
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12/27/2002
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Publication #:
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Pub Dt:
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09/18/2003
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Inventors:
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Joon Ho Yoon, Yong Chil Choi, Suk Su Bae
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Title:
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CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN-3-DONG, PALDAL-KU |
| SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF |
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| LOWE HAUPTMAN GILMAN & BERNER |
| RANDY A. NORANBROCK |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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