Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2005
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Application #:
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10617726
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Filing Dt:
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07/14/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Inventors:
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Young-Hwan Shin, Chong-Ho Kim, Tae-Gui Kim
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Title:
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PACKAGE SUBSTRATE MANUFACTURED USING ELECTROLYTIC LEADLESS PLATING PROCESS, AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN-3 DONG, PALDAL-GU, SUWON-SI |
KYUNGGI-DO 442-743, KOREA, REPUBLIC OF |
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MORGAN LEWIS & BOCKIUS LLP |
ROBERT J. GAYBRICK |
1111 PENNSYLVANIA AVENUE NW |
WASHINGTON, DC 20004 |
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