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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/15/2005
Application #:
10033880
Filing Dt:
12/19/2001
Publication #:
Pub Dt:
06/19/2003
Inventors:
John Guzek, Dustin Wood
Title:
METAL CORE INTEGRATED CIRCUIT PACKAGE WITH ELECTRICALLY ISOLATED REGIONS AND ASSOCIATED METHODS
Assignment: 1
Reel/Frame:
012633/0863Recorded: 02/25/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2002
Exec Dt:
01/08/2002
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP
MICHAEL A. PROKSCH
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES, CA 90025

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