Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10703587
|
Filing Dt:
|
11/10/2003
|
Publication #:
|
|
Pub Dt:
|
06/03/2004
| | | | |
Inventors:
|
Eun Sung Lee, Byeong-Cheon Koh, Chang-Youl Moon, Kukjin Chun
|
Title:
|
SIDE-BONDING METHOD OF FLIP-CHIP SEMICONDUCTOR DEVICE, MEMS DEVICE PACKAGE AND PACKAGE METHOD USING THE SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
416 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
|
|
|
LEE & STERBA, P.C. |
EUGENE M. LEE |
1101 WILSON BOULEVARD, SUITE 2000 |
ARLINGTON, VA 22209 |
|
|
Search Results as of:
09/25/2024 02:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|