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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/10/2005
Application #:
10177672
Filing Dt:
06/24/2002
Publication #:
Pub Dt:
11/21/2002
Inventors:
Shunichi Kikuchi, Misao Umematsu
Title:
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING, AND BOARD MEMBER WITH THIN-FILM STRUCTURE CAPACITOR FOR SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING
Assignment: 1
Reel/Frame:
013041/0518Recorded: 06/24/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/03/2002
Exec Dt:
06/03/2002
Assignee:
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA, 211-8588, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN & HATTORI, LLP
DONALD W. HANSON
1725 K STREET, N.W., SUITE 1000
WASHINGTON, D.C. 20006

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