Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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10708109
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Filing Dt:
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02/10/2004
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Inventors:
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Kun-Chih Wang, Bing-Chang Wu
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Title:
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SEMICONDUCTOR CHIP CAPABLE OF IMPLEMENTING WIRE BONDING OVER ACTIVE CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL |
| PARK |
| HSIN-CHU CITY, TAIWAN |
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| NAIPO (NORTH AMERICA INTERNATIONAL PATEN |
| P.O. BOX 506 |
| MERRIFIELD, VA 22116 |
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