Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/31/2005
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Application #:
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10029571
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Filing Dt:
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12/20/2001
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Publication #:
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Pub Dt:
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02/13/2003
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Inventors:
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Eiji Takahashi, Yukihiro Fukumoto, Yoshiyuki Saito, Osamu Shibata, Shinichi Tanimoto et al
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Title:
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MULTILAYER BOARD IN WHICH WIRING OF SIGNAL LINE THAT REQUIRES TAMPER-RESISTANCE IS COVERED BY COMPONENT OR FOIL, DESIGN APPARATUS, METHOD, AND PROGRAM FOR THE MULTILAYER BOARD, AND MEDIUM RECORDING THE PROGRAM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA-FU, JAPAN |
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| PRICE AND GESS |
| JOSEPH W. PRICE |
| 2100 S.E. MAIN STREET |
| SUITE 250 |
| IRVINE, CA 92614 |
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