Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10452566
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Filing Dt:
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05/30/2003
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Publication #:
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Pub Dt:
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04/15/2004
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Inventors:
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Chin Fa Wang, Wen-Ta Tsai, Yuan-Ping Joe
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Title:
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SEMICONDUCTOR PACKAGE WITH ENHANCED CHIP GROUNDABILITY AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD TANTZU |
TAICHUNG, TAIWAN R.O.C. |
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THE LAW OFFICES OF MIKIO ISHIMARU |
MIKIO ISHIMARU |
1110 SUNNYVALE-SARATOGA RD. |
SUITE A1 |
SUNNYVALE, CA 94087 |
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