Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10306931
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Filing Dt:
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11/27/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Inventor:
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Gu-Sung Kim
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Title:
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MULTI-CHIP PACKAGE (MCP) WITH A CONDUCTIVE BAR AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 16, BANWOI, RI, TAEAN-EUB |
| HWASUNG-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| ALAN T. MCCOLLOM |
| 1030 S.W. MORRISON STREET |
| PORTLAND, OR 97205 |
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