Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/12/2005
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Application #:
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10313434
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Filing Dt:
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12/05/2002
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Inventors:
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Nikhil V. Kelkar, Jaime Bayan
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Title:
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APPARATUS AND METHOD FOR A WAFER LEVEL CHIP SCALE PACKAGE HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BEYER WEAVER & THOMAS, LLP |
STEVE D. BEYER |
P.O. BOX 778 |
BERKELEY, CA 94704-0778 |
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