Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10672886
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Filing Dt:
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09/26/2003
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Inventors:
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Sung Soon Park, Sang Jae Jang, Choon Heung Lee, Seon Goo Lee, Sung Su Park, Eun Sook Sohn
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE REDUCING WARPAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1900 SOUTH PRICE ROAD |
CHANDLER, ARIZONA 85248-1604 |
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BEVER, HOFFMAN & HARMS, LLP |
JAMES E. PARSONS, ESQ. |
2099 GATEWAY PLACE, SUITE 320 |
SAN JOSE, CA 95110-1017 |
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Assignment:
2
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901 MAIN STREET |
22ND FLOOR |
DALLAS, TEXAS 75202 |
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CATHRYN A. BERRYMAN |
JENKENS & GILCHRIST, ET AL |
SUITE 3700 |
1445 ROSS AVENUE |
DALLAS, TX 75202 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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333 SOUTH HOPE STREET |
19TH FLOOR |
LOS ANGELES, CALIFORNIA 90071 |
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MCGUIREWOODS LLP |
1750 TYSONS BOULEVARD |
SUITE 1800 |
TYSONS, VA 22102 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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