Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10701562
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Filing Dt:
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11/06/2003
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Publication #:
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Pub Dt:
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12/23/2004
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Inventor:
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Hyoun Soo Shin
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Title:
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GAN LED FOR FLIP-CHIP BONDING AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN-3-DONG, PALDAL-KU, SUWON |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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LOWE HAUPTMAN GILMAN & BERNER |
BENJAMIN J. HAUPTMAN, 29,310 |
1700 DIAGONAL ROAD, SUITE 300 |
ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
GYUNGGI-DO, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 THIRTEENTH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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(MAETAN-DONG) 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
SEOUL, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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