Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/27/2005
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Application #:
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10459879
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Filing Dt:
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06/12/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Inventor:
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Yoichi Oya
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Title:
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Printed circuit board multi-layer structure with embedded device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35 KITASHINAGAWA, 6-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| HOLLAND & KNIGHT LLP |
| ROBERT J. DEPKE |
| 131 SOUTH DEARBORN STREET, 30TH FLOOR |
| CHICAGO, IL 60603 |
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