Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10659528
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Filing Dt:
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09/09/2003
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Publication #:
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Pub Dt:
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09/23/2004
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Inventor:
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Huan-Ping Su
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Title:
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SEMICONDUCTOR PACKAGE WITH HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, LI-HSIN ROAD, 3 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| THE LAW OFFICES OF MIKIO ISHIMARU |
| MIKIO ISHIMARU |
| 1110 SUNNYVALE-SARATOGA RD. |
| SUITE A1 |
| SUNNYVALE, CA 94087 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.2 LI-HSIN ROAD 3, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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