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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/08/2005
Application #:
10750443
Filing Dt:
12/30/2003
Publication #:
Pub Dt:
09/02/2004
Inventors:
Eric Neyret, Ludovic Ecarnot
Title:
METHOD FOR REDUCING FREE SURFACE ROUGHNESS OF A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
014620/0362Recorded: 05/11/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2004
Exec Dt:
01/12/2004
Assignee:
PARC TECHNOLOGIQUE DES FONTAINES
CHEMIN DES FRANQUES
38190 BERNIN, FRANCE
Correspondent:
WINSTON & STRAWN
PATENT DEPARTMENT
1400 L STREET, N.W.
WASHINGTON, DC 20005-3502

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