Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/29/2005
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Application #:
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10713804
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Filing Dt:
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11/14/2003
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Publication #:
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Pub Dt:
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05/19/2005
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Inventors:
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Uei-Ming Jow, Pei-Shen Wei, Ching-Liang Weng, Chun-Kun Wu, Ying-Jiunn Lai et al
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Title:
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EMBEDDED MICROELECTRONIC CAPACITOR INCORPORATING GROUND SHIELDING LAYERS AND METHOD FOR FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 51-103, TTSC/B100 |
| 195 SECTION 4, CHUNG HSING ROAD |
| CHUTUNG, HSINCHU, TAIWAN 310, R.O.C. |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F., NO. 18, PUDING RD., EAST DIST. |
| HSINCHU CITY 30072, TAIWAN R.O.C. |
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| KAMRATH IP LAWFIRM, PA |
| 4825 OLSON MEMORIAL HIGHWAY, SUITE 150 |
| GOLDEN VALLEY, MN 55422 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, SEC. 2, JIANGUO N. RD., JHONGSHAN DIST. |
| TAIPEI CITY 10487, TAIWAN R.O.C. |
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| KAMRATH IP LAWFIRM, PA |
| 4825 OLSON MEMORIAL HIGHWAY, SUITE 150 |
| GOLDEN VALLEY, MN 55422 |
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