Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10354130
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Filing Dt:
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01/30/2003
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Publication #:
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Pub Dt:
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04/29/2004
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Inventors:
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Jia-Wei Yang, Chih-Cherng Liao
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Title:
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DEEP TRENCH ISOLATION STRUCTURE OF A HIGH-VOLTAGE DEVICE AND METHOD FOR FORMING THEREOF
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Assignment:
1
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MORTGAGE (SEE DOCUMENT FOR DETAILS).
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| 123, PARK AVE-3RD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. 30077 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| JOE MCKINNEY MUNCY |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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