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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/06/2005
Application #:
10354130
Filing Dt:
01/30/2003
Publication #:
Pub Dt:
04/29/2004
Inventors:
Jia-Wei Yang, Chih-Cherng Liao
Title:
DEEP TRENCH ISOLATION STRUCTURE OF A HIGH-VOLTAGE DEVICE AND METHOD FOR FORMING THEREOF
Assignment: 1
Reel/Frame:
013725/0766Recorded: 01/30/2003Pages: 2
Conveyance:
MORTGAGE (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/24/2002
Exec Dt:
12/24/2002
Assignee:
123, PARK AVE-3RD
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C. 30077
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
JOE MCKINNEY MUNCY
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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