Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/13/2005
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Application #:
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10066643
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Filing Dt:
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02/06/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Inventors:
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Scot A. Kellar, Sarah E. Kim, R. Scott List
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Title:
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WAFER BONDING FOR THREE-DIMENSIONAL (3D) INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 220 MISSION COLLEGE BOULEVARD, SC4-202 |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANTONELLI, TERRY, STOUT ET AL. |
| HUNG H. BUI |
| 1300 N. 17TH ST, STE. 1800 |
| ARLINGTON, VA 22209 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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