Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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10201208
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Filing Dt:
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07/22/2002
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Publication #:
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Pub Dt:
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01/22/2004
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Inventors:
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Ford B. Grigg, William J. Reeder
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Title:
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METHODS OF ENCAPSULATING SELECTED LOCATIONS OF A SEMICONDUCTOR DIE ASSEMBLY USING A THICK SOLDER MASK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83707 |
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TRASKBRITT |
ANDREW F. NILES |
P.O. BOX 2550 |
SALT LAKE CITY, UTAH 84110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 DEER CREEK LANE |
MT. KISCO, NEW YORK 10549 |
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CHRISTOPHER C. HENRY |
ROPES & GRAY LLP |
1211 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10036 |
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