Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/24/2006
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Application #:
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10684743
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Filing Dt:
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10/14/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Inventors:
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Haruhisa Masuda, Yuji Munesawa, Koichi Warino, Tomoharu Nishioka, Yoshiro Iwata et al
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Title:
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MULTI-LAYER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1621, SAKAZU, KURASHIKI-SHI |
OKAYAMA 710-8622, JAPAN |
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1978-96 O-AZA KOGUSHI, UBE-SHI |
YAMAGUCHI-KEN 755-8633, JAPAN |
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PIPER RUDNICK LLP |
T. DANIEL CHRISTENBURY |
3400 TWO LOGAN SQUARE |
18TH AND ARCH STREETS |
PHILADELPHIA, PA 19103-2762 |
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