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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/24/2006
Application #:
10137094
Filing Dt:
05/01/2002
Publication #:
Pub Dt:
11/06/2003
Inventors:
Jie Chang, Stephen Chiu, Winfred Morris
Title:
INTEGRATED POWER MODULE WITH REDUCED THERMAL IMPEDANCE
Assignment: 1
Reel/Frame:
012869/0089Recorded: 05/01/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/19/2002
Exec Dt:
03/19/2002
Exec Dt:
03/19/2002
Assignee:
OFFICE OF THE GENERAL COUNSEL
P.O. BOX 3701, MC 13-08
SEATTLE, WASHINGTON 89124
Correspondent:
DIPINTO & SHIMOKAJI, P.C.
MICHAEL A. SHIMOKAJI
1301 DOVE STREET, SUITE 480
NEWPORT BEACH, CALIFORNIA 92660
Assignment: 2
Reel/Frame:
013018/0205Recorded: 05/01/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/19/2002
Exec Dt:
03/19/2002
Exec Dt:
03/19/2002
Assignee:
OFFICE OF THE GENERAL COUNSEL
P.O. BOX 3707, MC. 13-08
SEATTLE, WASHINGTON 89124
Correspondent:
DIPINTO & SHIMOKAJI, PC
MICHAEL A. SHIMOKAJI
1301 DOVE STREET SUITE 480
NEWPORT BEACH, CA 92660

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