Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10769460
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Filing Dt:
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01/30/2004
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Publication #:
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Pub Dt:
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08/04/2005
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Inventors:
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Pasi Tikka, Edgar Schmidhammer, Habbo Heinze, Reiner Welzer, Herbert Zidek et al
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Title:
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ENCAPSULATED ELECTRONICS DEVICE WITH IMPROVED HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KEILALAHDENTIE 4 |
| FIN-02150 ESPOO, FINLAND |
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| WARE FRESSOLA, VAN DER SLUYS ET AL. |
| KENNETH Q. LAO |
| BRADFORD GREEN, BUILDING 5 |
| 755 MAIN ST., P.O. BOX 224 |
| MONROE, CT 06468-0224 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ADD ADDITIONAL ASSIGNEE PREVIOUSLY RECORDED AT 015602 FRAME 0407.
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| KEILALAHDENTIE 4 |
| FIN-02150 ESPOO, FINLAND |
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| ST.-MARTIN-STR. 53 |
| 81669 MUNICH, GERMANY |
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| KENNETH Q. LAO |
| WARE FRESSOLA, VAN DER SLUYS ET AL. |
| BRADFORD GREEN, BUILDING 5 |
| 755 MAN STREET, P.O. BOX 224 |
| MONROE, CT 06468-0224 |
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