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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/07/2006
Application #:
10139052
Filing Dt:
05/03/2002
Publication #:
Pub Dt:
11/06/2003
Inventors:
Valery M. Dubin, Chin-Chang Cheng, Makarem A. Hussein, Phi L. Nguyen, Ruth A. Brain
Title:
USE OF CONDUCTIVE ELECTROLESSLY DEPOSITED ETCH STOP LAYERS, LINER LAYERS AND VIA PLUGS IN INTERCONNECT STRUCTURES
Assignment: 1
Reel/Frame:
012869/0573Recorded: 05/03/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/08/2002
Exec Dt:
04/09/2002
Exec Dt:
04/11/2002
Exec Dt:
04/18/2002
Exec Dt:
04/11/2002
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR, ET AL.
BRENT E. VECCHIA
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES, CA 90025

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