Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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11089725
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Filing Dt:
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03/24/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Inventor:
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David L. Bender
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Title:
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METHOD AND APPARATUS FOR CUTTING ULTRA THIN SILICON WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5102 CALLE DEL SOL |
| SANTA CLARA, CALIFORNIA 95054 |
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| WOODSIDE IP GROUP |
| MICHAEL HETHERINGTON |
| P.O. BOX 61047 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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GRANT OF PATENT SECURITY INTEREST
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| 20400 STEVENS CREEK BOULEVARD, SUITE 850 |
| CUPERTINO, CALIFORNIA 95014 |
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| BRIAN COVOTTA, ESQ. |
| O'MELVENY & MYERS LLP |
| 2765 SAND HILL ROAD |
| MENLO PARK, CA 94025 |
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Assignment:
3
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RELEASE OF SECURITY INTEREST
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| 5201 CALLE DE SOL |
| SANTA CLARA, CALIFORNIA 95054 |
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| DAVID JENNINGS |
| 7700 FORSYTH BLVD. |
| STE. 1800 |
| ST. LOUIS, MO 63105 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 5102 CALLE DEL SOL |
| SANTA CLARA, CALIFORNIA 95054 |
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| RICHARD A. SCHUTH (MEMC) |
| ARMSTRONG TEASDALE LLP |
| 7700 FORSYTH BLVD., SUITE 1800 |
| ST. LOUIS, MO 63105 |
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Assignment:
5
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 7832 N. LEADBETTER ROAD |
| PORTLAND, OREGON 97203 |
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| ZEYNEP GIESEKE |
| 233 S. WACKER DRIVE, SUITE 5800 |
| C/O LATHAM & WATKINS LLP |
| CHICAGO, IL 60606 |
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