Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10703482
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Filing Dt:
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11/10/2003
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Publication #:
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Pub Dt:
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05/12/2005
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Inventor:
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Su Hyun Kim
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Title:
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METHOD FOR FORMING BOND PAD OPENINGS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 SILICON DRIVE, SAMA JAYA FREE |
| INDUSTRIAL ZONE, KUCHING |
| SARAWAK, MALAYSIA 93350 |
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| GEORGE D. LIU |
| 2101 CRYSTAL PLAZA ARC |
| PMB 400 |
| ARLINGTON, VIRGINIA 22202 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1ST SILICON DRIVE, SAMA JAYA FREE |
| IDUSTRIAL ZONE |
| KUCHING, SARAWAK, MALAYSIA 93350 |
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| LAWRENCE Y.D. HO & ASSOCIATES PTE LTD |
| 30 BIDEFORD ROAD, #02-02, THONGSIA BUILD |
| SINGAPORE 229922 |
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