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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	7033905	Issue Dt:	04/25/2006	Application #:	10726039	Filing Dt:	12/01/2003
Publication #:	20040110378	Pub Dt:	06/10/2004
Inventors:	Bruno Ghyselen, Cecile Aulnette, Benedite Osternaud, Yves-Mathieu Le Vaillant et al
Title:	RECYCLING OF A WAFER COMPRISING A BUFFER LAYER AFTER HAVING SEPARATED A THIN LAYER THEREFROM BY MECHANICAL MEANS

Assignment: 1

Reel/Frame:

014759/0890

Recorded: 12/01/2003

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHYSELEN, BRUNO

Exec Dt:

09/10/2003

AULNETTE, CECILE

Exec Dt:

09/23/2003

OSTERNAUD, BENEDITE

Exec Dt:

10/02/2003

VAILLANT, YVES-MATHIEU

Exec Dt:

09/23/2003

AKATSU, TAKESHI

Exec Dt:

10/02/2003

Assignee:

S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.

PARC TECHNOLOGIQUE DES FONTAINES

CHEMIN DES FRANQUES

38190 BERNIN, FRANCE

Correspondent:

WINSTON & STRAWN

PATENT DEPARTMENT

1400 L STREET, N.W.

WASHINGTON, DC 20005-3502

Assignment: 2

Reel/Frame:

015946/0433

Recorded: 04/25/2005

Pages: 11

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNORS' NAMES PREVIOUSLY RECORDED ON REEL 014759, FRAME 0890 PREVIOUSLY RECORDED ON REEL 014759 FRAME 0890. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT.

Assignors:

GHYSELEN, BRUNO

Exec Dt:

09/10/2003