Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2006
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Application #:
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09834696
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Filing Dt:
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04/12/2001
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Publication #:
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Pub Dt:
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08/16/2001
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Inventors:
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Jerrold L. King, Jerry M. Brooks
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Title:
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SEMICONDUCTOR CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
KUEISHAN, TAOYUAN, TAIWAN |
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DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
701 FIFTH AVENUE |
SUITE 6100 |
SEATTLE, WA 98104-7043 |
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