Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10711674
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Filing Dt:
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09/30/2004
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Publication #:
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Pub Dt:
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01/12/2006
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Inventors:
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Chiu-Shun Lin, Kuan-Chou Lin, Chia-Hui Wu, Pai-Sheng Cheng
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Title:
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BONDING PAD AND CHIP STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 F., NO. 605, JHONGSHAN RD., SINHUA TOWNSHIP |
| TAINAN COUNTY, TAIWAN 712 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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