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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/20/2006
Application #:
10708935
Filing Dt:
04/01/2004
Publication #:
Pub Dt:
10/06/2005
Inventors:
Todd P. Oman, Thomas A. Degenkolb
Title:
MULTI-SUBSTRATE CIRCUIT ASSEMBLY
Assignment: 1
Reel/Frame:
014522/0800Recorded: 04/22/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/13/2004
Exec Dt:
04/14/2004
Assignee:
P. O. BOX 9005
ONE CORPORATE CENTER, CT10C
KOKOMO, INDIANA 46904-9005
Correspondent:
HARTMAN & HARTMAN, P.C.
552 EAST 700 NORTH
VALPARAISO, IN 46383
Assignment: 2
Reel/Frame:
045115/0001Recorded: 01/23/2018Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/29/2017
Assignee:
ERIN COURT, BISHOP'S COURT HILL
ST. MICHAEL, BARBADOS
Correspondent:
DELPHI TECHNOLOGIES IP LIMITED
5825 INNOVATION DRIVE
LEGAL STAFF - M/C 480-415-154
TROY, MI 48098

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