Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/27/2006
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Application #:
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10966816
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Filing Dt:
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10/15/2004
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Inventors:
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Charles W. C. Lin, Cheng-Lien Chiang
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Title:
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THREE-DIMENSIONAL STACKED SEMICONDUCTOR PACKAGE WITH METAL PILLAR IN ENCAPSULANT APERTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 487 BLACKFOOT STREET |
| SUPERIOR, CO 80027 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, 157 LI-TE ROAD |
| PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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| DAVID M. SIGMOND |
| 487 BLACKFOOT STREET |
| SUPERIOR, CO 80027 |
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