Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10821543
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Filing Dt:
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04/09/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Inventors:
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Hongfeng Yin, Kevin P. Killeen, Reid A. Brennen, Uwe Effelsberg
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Title:
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PARTICLE PACKING OF MICRODEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 7599 |
| M/S DL429 |
| LOVELAND, COLORADO 80537-0599 |
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| LEONOR S. TUCK |
| 1501 STEVENS CREEK BLVD., |
| M/S 54U-PD |
| SANTA CLARA, CA 95051-7201 |
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