Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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10871645
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Filing Dt:
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06/18/2004
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Publication #:
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Pub Dt:
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12/22/2005
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Inventors:
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Anthony L. Coyle, William D. Boyd, Chris Haga, Leland S. Swanson
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Title:
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SEMICONDUCTOR PACKAGE HAVING INTEGRATED METAL PARTS FOR THERMAL ENHANCEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474, MS 3999 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| YINGSHENG TUNG |
| P.O. BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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