Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10915326
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Filing Dt:
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08/11/2004
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Publication #:
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Pub Dt:
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02/16/2006
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Inventors:
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Hyung Jun Park, Hyeong No Kim, Sang Bae Park, Yong Gil Lee, Jun Young Yang, Jin Hee Won et al
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Title:
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PROCESS AND LEAD FRAME FOR MAKING LEADLESS SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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SHAW PITTMAN LLP |
MICHAEL D. BEDNAREK |
1650 TYSONS BOULEVARD |
MCLEAN, VA 22102 |
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