Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10871313
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Filing Dt:
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06/18/2004
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Inventors:
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Jaime A. Bayan, Ashok S. Prabhu, Shaw Wei Lee
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Title:
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SOLDER PAD CONFIGURATION FOR USE IN A MICRO-ARRAY INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DR. |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER WEAVER & THOMAS, LLP |
| JON Y. IKEGAMI |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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