Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10953120
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Filing Dt:
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09/28/2004
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Publication #:
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Pub Dt:
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12/08/2005
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Inventors:
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Yeong-Gyu Lee, Seung-Do An
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Title:
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SEMICONDUCTOR PACKAGE AND PACKAGING METHOD USING FLIP-CHIP BONDING TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN-3DONG |
| YOUNGTONG-GU, SUWON-SI, KYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| JERALD E. NAGAE, ESQ. |
| CHRISTENSEN O'CONNOR JOHNSON KINDNESS |
| 1420 FIFTH AVENUE, SUITE 2800 |
| SEATTLE, WA 98101-2347 |
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