Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/19/2006
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Application #:
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10867172
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Filing Dt:
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06/14/2004
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Inventors:
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Michael T. McClure, Jack Chocola, Kevin K. Lin, George Grama
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Title:
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WAFER LEVEL PACKAGING OF MATERIALS WITH DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 609501 |
| ORLANDO, FLORIDA 32860-9501 |
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| ALLEN, DYER, DOPPELT ET AL |
| CARL M. NAPOLITANO |
| 255 SOUTH ORANGE AVENUE, SUITE 1401 |
| POST OFFICE BOX 3791 |
| ORLANDO, FL 32801-3791 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2300 NE BROOKWOOD PARKWAY |
| HILLSBORO, OREGON 97124 |
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| SCHWABE WILLIAMSON & WYATT |
| PACWEST CENTER, SUITE 1900 |
| 1211 SW FIFTH AVENUE |
| PORTLAND, OR 97204 |
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