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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/03/2006
Application #:
10284123
Filing Dt:
10/31/2002
Publication #:
Pub Dt:
07/10/2003
Inventors:
Chang Won Park, Sung Ju Park, Hyung Su Lee, Jae Hoon Song
Title:
WRAPPED CORE LINKING MODULE FOR ACCESSING SYSTEM ON CHIP TEST
Assignment: 1
Reel/Frame:
013441/0329Recorded: 10/31/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Assignee:
455-6 MASAN-RI, JINWI-MYEON, PYEONGTAEK-SI
GYEONGG-DO, 451-865, KOREA, REPUBLIC OF
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
BRUCE H. BERNSTEIN
1941 ROLAND CLARKE PLACE
P 22932
RESTON, VA 20191
Assignment: 2
Reel/Frame:
014076/0811Recorded: 05/14/2003Pages: 6
Conveyance:
RE-RECORD TO CORRECT THE ADDRESS OF THE ASSIGNEE, PREVIOUSLY RECORDED ON REEL 013441 FRAME 0329, ASSIGNOR CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
Assignors:
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Exec Dt:
10/30/2002
Assignee:
455-6 MASAN-RI, JINWI-MYEON, PYEONGTAEK-SI
GYEONGGI-DO, 451-865, KOREA, REPUBLIC OF
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
BRUCE H. BERNSTEIN
1941 ROLAND CLARKE PLACE
RESTON, VIRGINIA 20191

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