Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/17/2006
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Application #:
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10751265
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Filing Dt:
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01/02/2004
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Inventors:
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Hamza Yilmaz, Anthony Chia, Seishi Fujimaki, Xiaoguang Zeng
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Title:
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SEMICONDUCTOR DEVICE PACKAGE DIEPAD HAVING FEATURES FORMED BY ELECTROPLATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1550 SHEFFIELD AVENUE |
| SAN JOSE, CALIFORNIA 95125 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| KENT J. TOBIN |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2880 LAKESIDE DRIVE, SUITE 203 |
| SANTA CLARA, CALIFORNIA 95054 |
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| KENT J. TOBIN |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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